专用于可植入应用的MHz AT-切割石英晶体

AT-切割石英晶体单元
频率范围为8至30MHz。高频基波(HFF)AT-切割晶体单元采用方向台面技术，工作频率范围为50至250MHz。

这些产品均为量身打造超高可靠性的应用。

在专用的装配线上进行生产，配合严格的测试和验证过程，确保了最佳性能。

MHz / SMD AT-cut Quartz Crystal

MHz Products catalog

Type

Package
[mm]

Frequency
[MHz]

Freq. Tol.
[ppm @ 25°C]

Temperature Range
[°C]

Thermal Stability
[ppm]

Features

Documents

CC8A-T1A

2.0 x 1.2 x 0.60

24 to 50 MHz

±50 ppm

TA:	–40 to	+85°C
TB:	–40 to	+125°C
TC:	–55 to	+125°C

±50	ppm
±80	ppm
±100	ppm

Smallest Package

数据表
应用手册

CM8A-T1D

2.0 x 1.2 x 0.60

24 to 50 MHz

±50 ppm

TA:	–40 to	+85°C
TB:	–40 to	+125°C
TC:	–55 to	+125°C

±50	ppm
±80	ppm
±100	ppm

Smallest Package

数据表
应用手册

CC7A-T1A

3.2 x 1.5 x 0.75

20 to 50 MHz

±50 ppm

TA:	–40 to	+85°C
TB:	–40 to	+125°C
TC:	–55 to	+125°C

±50	ppm
±80	ppm
±100	ppm

数据表
应用手册